Technical parameters
| Project | Parameters |
|---|---|
| Material | FR-4, CEM-3, Teflon, High TG, Aluminum |
| Max panel size | 25”×18” |
| Max layer size | 2-24 layer |
| Max board thickness | 3.2mm |
| Min board thickness | 0.4mm |
| Line width spacing (outer) | 4mil/4mil (H oz) |
| Line width spacing (inner) | 4mil/4mil (H oz) |
| Minimum inner pad | 5mil |
| Thinnest inner layer thickness | 4min |
| Inner layer copper thickness | 1/2oz |
| The end of the thickness of the outer copper coil | 1/2oz |
| Complete thickness | 0.20-4.0mm |
| Inner surface treatment | Brown Oxide |
| Multilayer layer alignment degree | ±3mil |
| Minimum finished hole | 0.2mm |
| Precision holes | ±2mil |
| Slot tolerance | ±3mil |
| PTH hole tolerance | ±2mil |
| Non-plated through hole diameter tolerance | ±1mil |
| Maximum aspect ratio hole plating | 10:1 |
| Layer to layer registration | ±3mil |
| Solder mask plug hole | 06mm (Max) |
| Min solder mask dam | 2mil |
| Etching tolerance | ±1mil |
| Solder mask hardness | 6H |
| Solder on the bit precision graphics | ±2mil |
| Solder bridge minimum width | 3.0mil |
| Maximum aperture plug oil | 0.6mm |
| Nickel Gold Nickel layer thickness | 120u”/240u” |
| Nickel Gold Gold layer thickness | 2u”/6u” |
| Impedance control and tolerance | ± 10% |
| Line peel strength | ≥61B/in |
| Warp | ≤0.75% |
| Surface treatment | Immersion Gold, Immersion Silver,
Immersion Tin, OSP, Spray pure tin, Gold-plated, HASL |
